Bumping Wires

Our bumping wire enables the formation of uniform and homogeneous bumps.

Our bumping wires are available with bump formation methods for increasingly smaller, thinner, and higher-density electronics packaging. Bumps can be formed on semiconductor devices, such as ICs and LSIs, and other microelectronic devices at a lower cost and with fewer irregularities.

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  • Bumps can be formed with a minimum variance in neck height
  • Bumps can be formed with a minimum variance in shape
  • Suitable for small-volume production

GBC Type

Features

  • In the high temperature storage test (200°C), the shear strength after bump formation, decreases less than other bumping wires (GBC)

GBE Type

Features

  • Chips are not damaged during bump formation
Neck Height

Neck Height

Bump Shape

Bump Shape

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